Resin for optical-semiconductor element encapsulation

摘要

The present invention provides a resin for encapsulating an optical-semiconductor element, comprising a polycarbodiimide represented by the following general formula (1): wherein R represents a diisocyanate residue, provided that at least one of the n pieces of the R groups is a diisocyanate residue having the framework represented by the following structural formula (2); R¹ represents a monoisocyanate residue; and n is an integer of 1 to 100.