发明名称 |
Electrical assembly with internal memory circuitized substrate having electronic components positioned thereon, method of making same, and information handling system utilizing same |
摘要 |
An electrical assembly which includes a circuitized substrate comprised of an organic dielectric material having a first electrically conductive pattern thereon. At least part of the dielectric layer and pattern form the first, base portion of an organic memory device, the remaining portion being a second, polymer layer formed over the part of the pattern and a second conductive circuit formed on the polymer layer. A second dielectric layer if formed over the second conductive circuit and first circuit pattern to enclose the organic memory device. The device is electrically coupled to a first electrical component through the second dielectric layer and this first electrical component is electrically coupled to a second electrical component. A method of making the electrical assembly is also provided, as is an information handling system adapted for using one or more such electrical assemblies as part thereof.
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申请公布号 |
US2006022310(A1) |
申请公布日期 |
2006.02.02 |
申请号 |
US20040900386 |
申请日期 |
2004.07.28 |
申请人 |
ENDICOTT INTERCONNECT TECHNOLOGIES, INC. |
发明人 |
EGITTO FRANK D.;LAUFFER JOHN M.;LIN HOW T.;MARKOVICH VOYA R.;THOMAS DAVID L. |
分类号 |
H01L23/58 |
主分类号 |
H01L23/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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