发明名称 Electrical assembly with internal memory circuitized substrate having electronic components positioned thereon, method of making same, and information handling system utilizing same
摘要 An electrical assembly which includes a circuitized substrate comprised of an organic dielectric material having a first electrically conductive pattern thereon. At least part of the dielectric layer and pattern form the first, base portion of an organic memory device, the remaining portion being a second, polymer layer formed over the part of the pattern and a second conductive circuit formed on the polymer layer. A second dielectric layer if formed over the second conductive circuit and first circuit pattern to enclose the organic memory device. The device is electrically coupled to a first electrical component through the second dielectric layer and this first electrical component is electrically coupled to a second electrical component. A method of making the electrical assembly is also provided, as is an information handling system adapted for using one or more such electrical assemblies as part thereof.
申请公布号 US2006022310(A1) 申请公布日期 2006.02.02
申请号 US20040900386 申请日期 2004.07.28
申请人 ENDICOTT INTERCONNECT TECHNOLOGIES, INC. 发明人 EGITTO FRANK D.;LAUFFER JOHN M.;LIN HOW T.;MARKOVICH VOYA R.;THOMAS DAVID L.
分类号 H01L23/58 主分类号 H01L23/58
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