| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laminated device employing a second die of 100 μm or less in thickness, in which device the height of a wire loop can be stabilized without using a spacer for supporting an end of the second die. <P>SOLUTION: According to the laminated device, a first die 11 is fixed on a board 10, and the second die 12, which is larger than the first die 11 and has the free end, is fixed on the first die 11. A first load W1, which is a bonding load, is applied to a capillary 40, with which bonding is carried out on a pad 12a on the second die 12 to form a pressure-bonding ball 30b. The load W1 applied to the capillary 40 is then replaced by a second load W2, which is so lighter than the first load W1 as to allow the second die 12 to eliminate its deflection by a restoring force due to the rigidity of the second die 12. Afterwards, the wire loop is formed and bonding is carried out on a lead 10b on the board 10. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
