| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent a junction from falling into an electrically opened state caused by the growth of a void in an alloy layer between a metal thin wire and a bonding pad. <P>SOLUTION: Just before a bonding pad 1 contacts and connects with a ball 4 at the head of a metal thin wire 2 which passes the first through hole 3 of a capillary 5, the bonding pad 1 is scratched on the surface by a needlelike protruding object 7 projected from a second through hole 6. Thus, the state of an uneven alloy layer is made to form by losing a part of the bonding pad 1 required for connection so as to prevent a junction from falling into an electrically opened defective state by suppressing the influence by the generated void. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
