发明名称 Small structure and method for fabricating the same
摘要 A small structure which uses bonding wires to prevent disturbance and provide support and a method of fabricating the same are provided. The small structure includes a floating body having a plurality of first contact pads, a base having a plurality of second contact pads, and a plurality of bonding wires electrically connecting the first and second contact pads and elastically supporting the floating body. The method of fabricating the small structure includes preparing a base, forming a sacrificial layer on the base, disposing a floating body on the sacrificial layer, connecting the base and the floating body with bonding wires, and removing the sacrificial layer. Thereby, fabrication costs of the small structure are reduced.
申请公布号 US2006022322(A1) 申请公布日期 2006.02.02
申请号 US20050192358 申请日期 2005.07.29
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM JONG-PAL;CHO YONG-CHUL;LEE BYEUNG-LEUL;LEE SANG-WOO;CHOI JOON-HYOCK
分类号 H01L23/02 主分类号 H01L23/02
代理机构 代理人
主权项
地址