MULTIPLE CHIP SEMICONDUCTOR DEVICE

摘要

A semiconductor device has first and second semiconductor chips comprising electronic circuit elements located at an inner part of the chip and first connection terminals located on an upper surface of the inner part of the chip. One of the chips has second connection terminals located at a peripheral part of the chip. The first and second semiconductor chips are mounted one on top of the other to form the device, connected together by the first connection terminals of the first and second semiconductor chips, and wherein the second connection terminals of the first semiconductor chip provide external connections to the device. The invention enables SoC resources to be increased based on the System-in-Package (SiP) approach by duplicating identical chip components into a single package.