发明名称 |
Method for positioning dicing line of wafer |
摘要 |
A method for positioning a dicing line includes the steps of: bonding an adhesive tape on a semiconductor layer of a wafer; detecting an image of the wafer by an imaging device on the basis of a light transmitted through the wafer; and determining the dicing line of the wafer on the basis of a position of an image of a marker, which is disposed on the semiconductor layer of the wafer. The image of the marker is obtained by image recognition from the detected image of the wafer. |
申请公布号 |
US2006024920(A1) |
申请公布日期 |
2006.02.02 |
申请号 |
US20050169579 |
申请日期 |
2005.06.30 |
申请人 |
DENSO CORPORATION |
发明人 |
GOTO KEISUKE;YOKOYAMA KENICHI |
分类号 |
H01L21/78;B81C99/00;H01L21/301;H01L21/46 |
主分类号 |
H01L21/78 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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