| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a surface acoustic wave device capable of attaining miniaturization for a chip while assuring the reliability of wire bonding even if a protecting film is arranged at the chip, and to provide its manufacturing method. <P>SOLUTION: The surface acoustic wave device comprises a SAW (Surface Acoustic Wave) chip 11, a package 20, bonding wires 30, a first silicone resin 40, and a second silicone resin. The SAW chip 11 comprises a substrate 12, IDTs 14 and 15 formed on the substrate 12, pads 13a, 14a, 14s, 15a, and 15s connected to the IDTs 14 and 15. The package 20 has lands 21a-25a. The bonding wires 30 connect the pads 13a, 14a, 14s, 15a, and 15s of the SAW chip 11 with the lands 21a-25a of the package 20. The first silicone resin 40 is coated and hardened at a part connecting the pads 13a, 14a, 14s, 15a, and 15s to the bonding wires 30. The second silicone resin with a thickness of less than 100nm is formed on the surface of the SAW chip when the first silicone resin 40 is hardened. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
