| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device, which can suppress the displacement caused by the thermal expansion of the die pad support 3 in the thickness direction of a die pad 2. <P>SOLUTION: The semiconductor device comprises the die pad 2; the die pad support 3 to support the die pad 2; a plurality of inner leads 4, whose tips are arranged around the die pad 2; and a semiconductor device 11, which is mounted on the die pad 2, having an outline dimension larger than that of the die pad 2. As a configuration of the die pad support 3, a stress relaxation portion 7 is provided in the area located between the die pad 2 and the tip of the inner lead 4, and the semiconductor device 11 being configured to be arranged on the stress relaxation portion 7. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
