| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a packaging structure of electronic component in which electric characteristics and transmission characteristics are enhanced by reducing parasitic capacitance. <P>SOLUTION: The electronic component packaging structure 1 is provided between two semiconductor elements 163 and 165 mounted on a circuit board 162, and has an AC coupling capacitor 167 for cutting off signals of predetermined frequency or below between these semiconductor elements 163 and 165. In the structure, the AC coupling capacitor 167 is separated partially or entirely from the circuit board 162 and mounted on the circuit board 162. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
