| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device which has an optimum structure for connecting wiring connection means with sufficient strength to an electrode formed on the surface of a semiconductor chip. <P>SOLUTION: A laminated electrode 13 comprising an Al electrode 11 and a CU electrode 12 is formed on the main surface of the semiconductor chip 14, and connection pads 19, 22, which are made by exposing the AL electrode 11, are formed on a part of the laminated electrode 13. The connection pads 19, 22 are connected to lead terminals 18, 21 of a lead frame via connection conductors 17, 20, at least whose surface is made of a material not containing Cu principally. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
