| 摘要 |
PROBLEM TO BE SOLVED: To provide a means for stably performing molding without flapping the tip of an inner lead in the case of resin molding using a metallic mold. SOLUTION: A semiconductor package includes an inner lead 2 formed by performing half etching on the lower surface side of the lead so as to leave a lead exposed surface 2a that becomes a substrate packaging surface in both terminals of a lead frame 1 on a lower surface side of the lead 2; and a package body 5 resin-molded integrally with an etching portion 2b applied to the inner lead, and molded to approximately recess its cross section so as to form a hollow portion 5c. In such a semiconductor package, the lower surface side of the tip 2c of the inner lead 2 remains as a non-etching portion 2d. COPYRIGHT: (C)2006,JPO&NCIPI |
