| 摘要 |
PROBLEM TO BE SOLVED: To provide a novel resin composition for sealing semiconductors exhibiting high adhesive properties to Ag, Pd and Pd-Au and hardly undergoing peeling after moisture absorption reflow, and a semiconductor device sealed with the resin composition for sealing semiconductors. SOLUTION: The epoxy resin composition for sealing a lead frame-type semiconductor device comprises at least an epoxy resin, a curing agent, an inorganic filler and a diphenyl disulfide derivative represented by formula (I) (wherein R<SP>1</SP>and R<SP>2</SP>are the same or different and are each a hydrogen atom or a substituent group selected from the group consisting of an alkyl group, a hydroxy group, a carboxy group and an amino group and at least one of R<SP>1</SP>and R<SP>2</SP>is a hydroxy group, a carboxy group or an amino group), where the content of the diphenyl disulfide derivative is 0.01-1 wt% based on the whole amount of the resin composition. COPYRIGHT: (C)2006,JPO&NCIPI |
