| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for inspecting electronic components for simply confirming the occurrence state of cracks of soldered joint parts by a thermal cycle test in a short period. SOLUTION: The method for inspecting the electronic components performs the thermal cycle test by bonding strain sensors 7 on the soldered joint parts of the electronic components 1 mounted by soldering leads 3 on substrates, and determines whether the soldered joint parts are good or not on the basis of electric output obtained by the strain sensors 7 during the thermal cycle test. COPYRIGHT: (C)2006,JPO&NCIPI
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