| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition easy to adjust its resin flow, to provide a multilayer printed wiring board reduced in resin intrusion into a cavity by using the adhesive composition, and to provide a method for producing the multilayer printed wiring board. SOLUTION: The adhesive composition essentially consists of a thermoplastic resin, a high-molecular-weight polyphenylene ether resin having a number-average molecular weight of 80,000 to 120,000 and obtained by the polycondensation of at least one monocyclic phenol, and an elastomer with a main chain in which part of the structural units are crosslinked. The multilayer printed wiring board is prepared by using the adhesive composition to bond constituent boards. The method for producing the multilayer printed wiring board comprises using the adhesive composition as a varnish, applying the varnish to bonding surfaces of constituent boards, drying the boards, and applying heat and pressure to them. COPYRIGHT: (C)2006,JPO&NCIPI |
