| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed circuit board which includes a flat package IC to be soldered by a dip solder, and in which the shape/size of a solder pull land is optimized for preventing a solder bridge from being formed on the printed circuit board and a flexibility of design is improved. SOLUTION: Each of a solder induction land 16 and a solder guide land 17 is comprised of a plurality of divided (two triangular shaped) lands 16a/16b (17a/17b), and a length of a solder pull land 18 in a substrate feeding direction 13 (in the lengthwise direction) is made into 2√2 multiple of a length L of lands comprising a land group 15 in the lengthwise direction, so that the flexibility in a wiring pattern is improved while preventing a solder bridge in a dip solder step. COPYRIGHT: (C)2006,JPO&NCIPI
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