| 摘要 |
PROBLEM TO BE SOLVED: To perform proper gas evacuation in a film depositing apparatus for processing of depositing a film, by alternately supplying first material gas and second material gas into a reaction container in which a substrate is conveyed and evacuating unreacted gas into a gas treatment facility. SOLUTION: When the first material gas is supplied to the reaction vessel, the reaction vessel is exhausted by a first vacuum evacuation means via a first vacuum evacuation passage, and the gas is sent to the gas treatment facility via a first exhaust passage. Moreover, when the second material gas is supplied to the reaction vessel, a channel is switched by a switching means, vacuum evacuation is performed by a second vacuum evacuation means through a second vacuum evacuation passage, and the gas is sent to the gas treatment facility via a second exhaust passage. In this case, the generation of a reactant by the mixture of the material gases in the exhaust passage can be suppressed, and clean gas evacuation can be performed. COPYRIGHT: (C)2006,JPO&NCIPI
|
