发明名称 CHIP SENSING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method of detecting chips adhered to work with a simple configuration. SOLUTION: A sensing plate 2 is placed at ahead of a probe arm 6 fitted with a probe 7 at its tip so as to be aligned with the external appearance of work 20 when it is seen from the sliding direction of an external diameter measuring device 5, with a fixed gap in between. When a sliding mechanism 8 slides the external diameter measuring device 5 to measure a measurement portion 21, and a touch sensor 10 finds the occurrence of power conveyance between the sensing plate 2 and work 20, it is judged that a cut chip 30 adheres on work 20. Thus, only by adding the sensing plate 2 and the touch sensor 10 to the external diameter measuring device 5, it is possible to surely detect the cut chip 30 attached to work 20. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006026832(A) 申请公布日期 2006.02.02
申请号 JP20040211000 申请日期 2004.07.20
申请人 JATCO LTD 发明人 OCHIAI KAZUYA
分类号 B23Q17/20 主分类号 B23Q17/20
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