| 摘要 |
<p>PURPOSE: A semiconductor package is provided to easily stack a plurality of semiconductor chips, by connecting a conductive wire exposed to the outside of an encapsulating material with an input/output pad of another semiconductor chip by using a conductive bump. CONSTITUTION: The first semiconductor chip(1) has the first and second surfaces(1a,1b). A plurality of input/output pads(1c) are formed on the second surface. A substrate is attached to the first surface of the first semiconductor chip, and is connected to the first semiconductor chip by a conductive wire(20). The substrate can be mounted on a mother board. An encapsulating material(40) encapsulates the substrate, the first semiconductor chip and the conductive wire, and the region of the conductive wire having the highest loop height is exposed to the exterior. The second semiconductor chip(2) has the first and second surfaces(2a,2b), and a plurality of input/output pads are formed on the first surface of the second semiconductor chip. The input/output pads of the second semiconductor chip are connected to the conductive wire exposed to the outside of the encapsulating material by the conductive bump(30).</p> |
