| 摘要 |
PROBLEM TO BE SOLVED: To provide a jig for depositing usable in a depositing step for a longer period of time without changing a shape, weight, thermal capacity with little consumption even in the case of repeatedly regenerating. SOLUTION: A dummy wafer 1a used for the depositing step of a polysilicon film is used repeatedly in the depositing step. The polysilicon film adhered in the depositing step is removed by etching and regenerated. In the case of processing to regenerate the polysilicon film, at least the part of the exposure surface D0 exposed during the depositing is covered with a nitride film 201 beforehand in the dummy wafer 1a. COPYRIGHT: (C)2006,JPO&NCIPI
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