| 摘要 |
PROBLEM TO BE SOLVED: To provide a foreign matter inspection method for wafers capable of detecting foreign matters, particularly, on a wafer in carrying on the real-time base, and a foreign matter inspecting device for preventing a large quantity of defects to keep a yield in a mass production line of a semiconductor manufacturing process. SOLUTION: In the mass production line of the semiconductor manufacturing process, the foreign matter inspecting device is miniaturized and placed on a carrying system between the input and output ports of a processor or between processors in a semiconductor manufacturing line. Foreign matters on a repeated pattern part on a product wafer 111 are detected by a refractive index change-type lens array, a spatial filter and a pattern information removing circuit, whereby the foreign matter inspection can be performed for wafers in carrying. Further, foreign matters are monitored only by a simple foreign matter monitor 101 in the mass production line of the semiconductor manufacturing process, whereby the production line can be weight-saved, to reduce the manufacturing cost. COPYRIGHT: (C)2006,JPO&NCIPI
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