| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin paste which maintains the insulation reliability of fine pitch wirings under high temperature and high humidity, prevents the impregnation of plating components into the end of a protecting film, prevents the diffusion of a plating layer in a wiring, and has excellent low curvature, flexibility, adhesiveness to sealers, solvent resistance, chemical resistance, heat resistance, electric characteristics, moisture resistance, workability and profitability which are necessary as films for protecting flexible wiring boards, and to provide a flexible wiring board using the same. SOLUTION: This thermosetting resin paste comprising (A) 100 pts.wt. of a thermosetting resin and (B) 100 to 1,000 pts.wt. of inorganic fine particles and having a curing temperature of≤120°C and a water absorbance percent of <0.1% at 25°C in the form of a cured film, as a film for protecting the surface of a flexible wiring board whose all wiring pattern portions are plated. The flexible wiring board which uses the thermosetting resin paste as a protecting film and whose all wiring pattern portions are plated. COPYRIGHT: (C)2006,JPO&NCIPI
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