METHOD OF MOUNTING SEMICONDUCTOR DEVICE

摘要

A method of mounting a semiconductor device, wherein a flip chip bonder for mounting a semiconductor chip on an electronic circuit substrate while reversing the front and back of the semiconductor chip is increased in speed to increase productivity. These operations are performed by a high-speed reverse operation by a cam mechanism connected to a motor rotating at a specified speed and a profiling positioning by a cam mechanism operated by the motor. Also, for the profiling positioning, the cam face of a roller gear cam type index table is partly removed to lower the rigidity of an inverting shaft in the rotating direction at a positioning part.