| 摘要 |
PROBLEM TO BE SOLVED: To provide a new radiation method for radiating electronic components without using radiation components such as a radiation fin and a heat pipe in the radiating method of the electronic components on a printed circuit board to reduce costs of the radiation components, thus enabling the application of the method into a device where the radiation components can't be used, and increasing the reliability of the electronic components. SOLUTION: Patterns each having at least two thermal conductivities are alternately disposed on a printed circuit board to diffuse the heat of the electronic components which are heating elements to the other pattern, and the heating elements are cooled by taking in air in the upper section of the other pattern as the air plenished by an upward current generated by the heat released by the heating elements. COPYRIGHT: (C)2006,JPO&NCIPI
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