| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin and low cost semiconductor laser package and a method of manufacturing the same package. SOLUTION: The light emitted from an LD4 is reflected with the upper surface of a mirror 5 to change the direction of an optical axis and is then radiated in the direction La from the upper surface of a glass substrate 6. The LD4 and the mirror 5 are mounted with a solder material A on the surface of flat substrate 2, and a frame 3 opening in both upper and lower surfaces is mounted thereafter on a solder material B substrate 2. Therefore, surface polishing of the substrate 2 mounting LD4 and mirror 5 thereon can be conducted with higher accuracy without use of a special jig. COPYRIGHT: (C)2006,JPO&NCIPI
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