发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing apparatus capable of easily replacing a blowout heating lamp. SOLUTION: A CVD apparatus 10 comprises a process tube 11 configuring a wafer process chamber 14, a plurality of the heating lamps 42 for emitting heat rays, and a reflector 47 for reflecting the heat rays of the heating lamps 42 in a direction of the process chamber 14. A group of the heating lamps 42 is vertically arranged, and a heating lamp support device 70 located to upper and lower parts of the reflector 47 supports the heating lamps 42. A retainer 74 energized by springs 78 supported by a cap 77, whereby the reaction force is obtained, is inserted to each of guide holes 72 opened to a support ring 71 of each of the heating lamp support devices 70 at an equal interval in its circumferential direction. A part 42b to be supported of each of the heating lamps 42 is supported between the retainer 74 and the guide hole 72, and a male connector 42a is connected to a female connector 80. Support of the part 42b to be supported is released by moving the retainer 74 and a blowout heating lamp 42 can be replaced by extracting it radially. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006032409(A) 申请公布日期 2006.02.02
申请号 JP20040204690 申请日期 2004.07.12
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 OKA TAKENORI;SHIMADA SHINICHI;TSUKAMOTO HIDEYUKI;HAYASHIDA AKIRA
分类号 H01L21/31;C23C16/46;H01L21/22;H01L21/26 主分类号 H01L21/31
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