| 发明名称 |
Composition for cooling component e.g. electronic component, that gives off heat, comprises carrier material containing dispersed silicon carbide particles |
| 摘要 |
<p>A composition for cooling a component that gives off heat, e.g. an electronic component, comprises a carrier material containing dispersed silicon carbide particles. The particles have at least two different sizes.</p> |
| 申请公布号 |
DE102004034224(A1) |
申请公布日期 |
2006.02.02 |
| 申请号 |
DE20041034224 |
申请日期 |
2004.07.15 |
| 申请人 |
MANDARIN PACIFIC MANAGEMENT S.L., PALMA DE MALLORCA |
发明人 |
ROEMMEN, MARKUS;EHRHARDT, DIETER;FLECHSIG, THOMAS;FLECHSIG, FRANK |
| 分类号 |
C09K5/10;G06F1/20;H01L23/34;H05K7/20 |
主分类号 |
C09K5/10 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
