MANUFACTURING METHOD OF VIA HOLE, MANUFACTURING METHOD OF MODULE WITH BUILT-IN COMPONENT, AND LASER MACHINING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a module with a built-in component capable of ensuring stable connection reliability even in inner via hole connection having a high aspect ratio of the component containing module.

SOLUTION: The manufacturing method of a via hole comprises a sticking process of sticking a protective member 102a on opposite faces of an insulating base member 101a having a mixture of an inorganic filler and thermosetting resin, a through hole forming process of forming a plurality of through holes 103 at predetermined positions of the insulating base member 101a and the protective member 102a by punching, and a laser irradiation process of removing punch debris 110 in the plurality of the through holes 103 by irradiating a laser beam 112. The spot size of the laser beam 112 is less than a diameter of the through hole 103.

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