发明名称 Power module and electric transportation apparatus incorporating the same
摘要 A power module includes a plurality of first semiconductor devices disposed so as to define a first layer in a substantially common plane, a plurality of second semiconductor devices disposed so as to define a second layer in a substantially same plane, and at least one metal plate electrically connected to at least two semiconductor devices selected from among the plurality of first and second semiconductor devices. The first layer and second layer are stacked such that the plurality of second semiconductor devices do not overlap the plurality of first semiconductor devices.
申请公布号 US2006022355(A1) 申请公布日期 2006.02.02
申请号 US20050189046 申请日期 2005.07.25
申请人 MURAI TAKAYUKI;MORITA KOJI 发明人 MURAI TAKAYUKI;MORITA KOJI
分类号 H01L29/76 主分类号 H01L29/76
代理机构 代理人
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