发明名称 Layer arrangement
摘要 A process for producing a layer arrangement, in which a plurality of electrically conductive structures are formed on a substrate, a first electrically insulating layer is formed on the plurality of electrically conductive structures, in such a manner than trenches are formed between mutually adjacent regions of the first electrically insulating layer, electrically insulating structures are formed in the trenches between the adjacent regions of the first electrically insulating layer, material of the first electrically insulating layer is removed, so that airgaps are formed between the electrically insulating structures and the electrically conductive structures, and a second electrically insulating layer is formed on the electrically conductive structures and on the electrically insulating structures, in such a manner that the second electrically insulating layer spans adjacent electrically conductive structures and electrically insulating structures.
申请公布号 US2006022345(A1) 申请公布日期 2006.02.02
申请号 US20050195332 申请日期 2005.08.01
申请人 INFINEON TECHNOLOGIES AG 发明人 SCHINDLER GUNTHER;PAMLER WERNER
分类号 H01L21/4763;C23C16/00;H01L23/52 主分类号 H01L21/4763
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