发明名称 |
Electronic component embedded substrate and method for manufacturing the same |
摘要 |
An electronic component embedded substrate and a method for manufacturing the substrate are disclosed. The electronic component embedded substrate includes a substrate main body and an electronic component embedded in the substrate main body. The center plane of the electronic component in the thickness direction thereof and the center plane of the substrate main body in the thickness direction thereof generally match each other.
|
申请公布号 |
US2006021791(A1) |
申请公布日期 |
2006.02.02 |
申请号 |
US20050190651 |
申请日期 |
2005.07.27 |
申请人 |
SUNOHARA MASAHIRO;HIGASHI MITSUTOSHI;MURAYAMA KEI;KATO HIROYUKI |
发明人 |
SUNOHARA MASAHIRO;HIGASHI MITSUTOSHI;MURAYAMA KEI;KATO HIROYUKI |
分类号 |
H05K1/03 |
主分类号 |
H05K1/03 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|