| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method in which the wiring density of a ceramic laminate substrate which has conductor wires and through conductors formed by charging a conductive material in internal spaces is increased by making hole diameters smaller. SOLUTION: A plurality of green sheets 26 where an internal dummy wire 28 and a through hole 30 are formed are laminated and pressed by a high-rigidity flat pressure surface 38 into a laminate and a burning process. Then while the green sheets 26 are densely sintered, the internal dummy wire 28 disappears and a laminar space in its shape is formed. Then molten liquid injected into the laminar space and through hole 30 is solidified to form an internal wire 14 and a through conductor 24, thereby obtaining the laminate substrate. Consequently, surface-directional deformation is suppressed because the green sheets 26 are pressed by the flat pressure surface 38 which does not substantially deform at right angles to their surfaces, and then the through hole 30 is suitably deterred from being deformed or crushed even when still hollow. COPYRIGHT: (C)2006,JPO&NCIPI |
