发明名称 |
METHOD FOR ENCAPSULATING AN ELECTRONIC COMPONENT USING A PLASTIC OBJECT, AND PLASTIC OBJECT |
摘要 |
The invention relates to a method for encapsulating an electronic component in a mould by the processing steps of: placing the component into a mould cavity, feeding encapsulating material, and curing the encapsulating material, wherein the electronic component is shielded by an object. The invention also relates to an object |
申请公布号 |
WO2006011791(A2) |
申请公布日期 |
2006.02.02 |
申请号 |
WO2005NL00544 |
申请日期 |
2005.07.26 |
申请人 |
FICO B.V.;DE VRIES, FRANCISCUS BERNARDUS ANTONIUS;GAL, WILHELMUS GERARDUS JOZEF |
发明人 |
DE VRIES, FRANCISCUS BERNARDUS ANTONIUS;GAL, WILHELMUS GERARDUS JOZEF |
分类号 |
H01L21/68 |
主分类号 |
H01L21/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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