| 摘要 |
PROBLEM TO BE SOLVED: To provide a means for improving the adhesion strength of an outer lead, particularly of its exposed portion with a resin substrate without affecting solder bonding in the case of packaging, in a resin hollow package for housing a semiconductor that includes the exposed portion on the bottom surface of the resin substrate of the outer lead. SOLUTION: A lead frame 10 is disposed inside a resin substrate 30 comprising a package, an upper face of one terminal of an inner lead 11 of this lead frame 10 is exposed in a hollow part 20 of the package, an outer lead 13 of another terminal side is exposed on the bottom surface 31 of the resin substrate 30, and the exposed portion of this outer lead 13 is defined as a bonding portion with a semiconductor circuit. In such a resin hollow package for housing the semiconductor, a resin-ingression portion (thickness reduced portion 13b) is formed in a resin buried portion, other than the exposed portion, of the outer lead 13 at least. COPYRIGHT: (C)2006,JPO&NCIPI
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