| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device holding down a production cost and preventing the deterioration of an element performance due to heating at a high temperature while preventing any crack of a semiconductor element and a joining section generated after a mounting. <P>SOLUTION: The semiconductor device is constituted so that the semiconductor element 1 is flip-chip connected to an external circuit. The semiconductor device has an element electrode 2 formed on the flip-chip connecting surface of the semiconductor element; and an insulating layer 3 from which at least a part of the element electrode is exposed, and which is disposed to the flip-chip connecting surface. The semiconductor device further has a terminal electrode 4 for a connection with the external circuit annexed on the element electrode and a resin supporter 5 disposed on the insulating layer in at least a part in the periphery of the terminal electrode. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
