发明名称 |
MANUFACTURING METHOD OF LAMINATED ELECTRONIC COMPONENT |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a laminated electronic component capable of quickly and easily manufacturing the laminated electronic component with high quality. <P>SOLUTION: A substrate 1 is prepared that is optically transparent and formed with an optical catalysis functional film 2 and a position reference mark M. A green sheet 3 is formed on the optical catalysis functional film 2 of the substrate 1. The green sheets 3 are laminated by overlapping two of the substrates 1 with the green sheet 3 formed thereon in a positioned state on the basis of the position reference mark M to obtain a layered body 10. An ultraviolet ray UV is emitted to one of the substrates 1 overlapped with each other to exfoliate one substrate 1 from the layered body 10. The layered body 10 from which one substrate 1 is exfoliated is cut on the other substrate 1 on the basis of the position reference mark M and divided into a plurality of divisions. The ultraviolet rays UV are emitted to plurality of layered body divisions of the layered body 10 from the other substrate 1 to exfoliate the layered body divisions from the other substrate 1. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
申请公布号 |
JP2006032428(A) |
申请公布日期 |
2006.02.02 |
申请号 |
JP20040205082 |
申请日期 |
2004.07.12 |
申请人 |
TDK CORP |
发明人 |
ONODERA AKIRA;ITO YOSHIKAZU;SOSHI YOSHIICHI;SHINDO ATSUSHI;MARUYAMA TOSHIKI |
分类号 |
H01G4/12;C04B35/622;H01G4/30 |
主分类号 |
H01G4/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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