| 摘要 |
PROBLEM TO BE SOLVED: To prevent even a portion not to be soldered on a printed circuit board from being also soldered by effectively preventing warp of a soldering pallet caused by solder heat. SOLUTION: A soldering pallet disposes electronic components 6 and 7 on the front surface of a printed circuit board 2, holds the rear side of the printed circuit board 2 when soldering leads 8 and 9 of the electronic components 6 and 7 protruded on a rear surface of the printed circuit board 2, and includes an opening 13 in a part to be soldered. In such a soldering pallet, a plurality of pallet members 10, 11 having different thermal expansion coefficients are laminated and formed in the direction of thickness so as to prevent a solder from being warped by heat. COPYRIGHT: (C)2006,JPO&NCIPI |
