| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of a layered electronic component capable of forming a protection film without making processes complicated. SOLUTION: The electronic component sequentially laminate and press magnetic green sheets 11 to 15 on which electrodes corresponding to conductor patterns 11a to 15a and through-electrodes 11b to 14b are formed, conductor green sheets 21 to 25 on which electrodes corresponding to capacitor electrodes 21a to 25a are formed, a green sheet 31 on which a resistor corresponding to a resistor 33 and a protection region or the like corresponding to a protection film 40 are formed, and a green sheet 32 or the like on which electrodes corresponding to a conductor pattern 37 and a through-electrode 38 are formed. Thus, a layered intermediate body can be obtained on which a coil 10, a capacitor 20, a resistor 30, and the protection film 40 are laminated. The intermediate body obtained as above is cut into units of chips and thereafter they are sintered at a prescribed temperature to obtain an element 1. Input/output terminals and a ground terminal are formed to the obtained element 1. COPYRIGHT: (C)2006,JPO&NCIPI
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