发明名称 |
Heat sink and heat spreader bonding structure |
摘要 |
A heat sink and heat spreader bonding structure includes a metal heat sink, a metal heat spreader, and an eutectic structure formed between the heat sink and the heat spreader by heating the heat sink and the heat spreader to a specific temperature of the eutectic temperature of the heat sink and the heat spreader but below the respective melting point of the heat sink and the heat spreader to cause the internal metal atoms of the heat sink and heat spreader to be rearranged. This bonding structure maintains the heat transfer efficiency of the bonding layer between the heat sink and the heat spreader, eliminates formation of crevice, heat resistance, and oxidation in the bonding layer.
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申请公布号 |
US2006021734(A1) |
申请公布日期 |
2006.02.02 |
申请号 |
US20040999928 |
申请日期 |
2004.12.01 |
申请人 |
CHANG SHIH-YING;CHUANG TUNG-HAN;YEH LAN-KAI;LIN CHE-WEI;TSAI MING-JYE |
发明人 |
CHANG SHIH-YING;CHUANG TUNG-HAN;YEH LAN-KAI;LIN CHE-WEI;TSAI MING-JYE |
分类号 |
H05K7/20;B23K1/00;G06F1/20;H01L21/48;H01L23/367 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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