System and method for installing a tamper barrier wrap in a PCB assembly, including a PCB assembly having improved heat sinking

摘要

A method of attaching a tamper wrap to a printed circuit board using an installation tool that is placed over the main body portion of the tamper wrap. The side tabs of the tamper wrap are folded up against the side walls of the installation tool, and the tamper wrap and the installation tool are inserted into an enclosing case. The installation tool is then removed, the printed circuit board to be wrapped is placed into the enclosing case, and the side tabs are folded and adhered down onto the top surface of the printed circuit board. Also, a printed circuit board assembly having improved heat sinking capabilities including a thermally conductive material located between a printed circuit board and a tamper wrap such that the electronic components are in thermal contact with an enclosing case for enclosing the printed circuit board and the tamper wrap.