发明名称 TWO-COMPONENT CURABLE SOLVENTLESS ADHESIVE
摘要 <p>A two-component curable solventless adhesive with which a laminated composite film composed of a laminate of barrier layer and plastic film even after sterilization at high temperature retains excellent appearance and bonding strength over a prolonged period of time and with which at the manufacturing of the laminated composite film, the reaction between a base resin and a curing agent is appropriately regulated to thereby ensure desirable workability. There is provided a two-component curable solventless adhesive comprising a base resin and a curing agent, wherein the base resin contains a polyol having secondary or tertiary terminal hydroxyls in a proportion of 30% or more based on all the terminal hydroxyls and containing an acid group, while the curing agent contains an isocyanate-terminated urethane prepolymer from a raw polyisocyanate containing at least an aromatic-aliphatic polyisocyanate and/or a substance resulting from modification thereof, in which the content of low-molecular-weight polyisocyanates of 190 or less molecular weight is 3 wt.% or below.</p>
申请公布号 WO2006011256(A1) 申请公布日期 2006.02.02
申请号 WO2005JP02105 申请日期 2005.02.04
申请人 MITSUI TAKEDA CHEMICALS, INC.;IMAI, AKIHIRO;IMAMURA, KAZUAKI;MORIMOTO, TAIJI;KAWASAKI, HIROSHI;MATSUFUJI, MIKIO 发明人 IMAI, AKIHIRO;IMAMURA, KAZUAKI;MORIMOTO, TAIJI;KAWASAKI, HIROSHI;MATSUFUJI, MIKIO
分类号 (IPC1-7):C09J175/04;C08G18/40 主分类号 (IPC1-7):C09J175/04
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