| 摘要 |
<p>A semiconductor device wherein a plurality of chips are mounted at a high speed and a high density at a low cost. When a storing device chip (103) and an ASIC (104) are mounted on a wiring chip (102), connecting pads (110, 116) are provided respectively on the storing device chip (103) and the ASIC (104) along one side on the wiring chip (102) where the storing device chip and the ASIC oppose each other. Therefore, the arrangement positions of each of the connecting pads (110, 116) are at a shortest distance, and wiring arranged on the wiring chip (102) is shortened. In the storing device chip (103) and the ASIC (104), the wiring chip (102) can be mounted on the wiring chip (102) at a high density, and its wiring distance can be shortened, and thus high-speed mounting can be attained.</p> |
