发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of preventing a tantalum oxide film from being made a thin film in the vicinity of the upper end of a lower electrode and of preventing leakage from happening between a lower electrode and an upper electrode at that portion. <P>SOLUTION: The semiconductor device comprises a silicon oxide film having a recess, a lower electrode formed in the recess, a silicon nitride film provided in the vicinity of the upper end of the lower electrode, the tantalum oxide film formed to cover the lower electrode, and the upper electrode formed on the tantalum oxide film. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006032675(A) 申请公布日期 2006.02.02
申请号 JP20040209698 申请日期 2004.07.16
申请人 RENESAS TECHNOLOGY CORP 发明人 SEKIKAWA HIROAKI
分类号 H01L21/8242;H01L21/822;H01L27/04;H01L27/108 主分类号 H01L21/8242
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