| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a high-density printed circuit board by applying a strippable adhesive layer on a reinforced substrate (rigid substrate or carrier film) used as a base substrate, forming a metal foil on the adhesive layer by means of plating, lamination, or sputtering, and forming a high-density circuit on the metal foil serving as a seed layer by means of pattern plating. SOLUTION: A method of manufacturing a high-density printed circuit board comprises a step of attaching an adhesive means to one surface of a reinforced substrate (rigid substrate or carrier film), a step of forming a seed layer 503 on the adhesive means; a step of forming a circuit pattern 504 on the seed layer 503, a step of laminating an insulating layer 505 on the circuit pattern 504, a step of removing the reinforced substrate (rigid substrate or carrier film), and a step of removing the seed layer 503. COPYRIGHT: (C)2006,JPO&NCIPI |
