METHOD AND DEVICE FOR PEELING SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To provide a method and a device for peeling semiconductor wafer by which the breakage of a semiconductor wafer can be prevented when peeling the wafer from a support. SOLUTION: The method of peeling the semiconductor wafer 30 stuck to the rigid support 20 through a sticking material 28 includes inserting steps (a and b) of inserting an inserting member 6 into the sticking material 28, and a vibrating step (c) of applying vibrations to the sticking material 28 by vibrating the inserting member 6 while the member 8 is biased in the direction in which the semiconductor wafer 30 is peeled from the support 20. COPYRIGHT: (C)2006,JPO&NCIPI