发明名称 APPARATUS AND METHOD OF ETCHING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide an apparatus of etching a substrate which can make the amount of etching uniform in the surface of the substrate. SOLUTION: The apparatus of etching the substrate includes an etching bath 1, a cassette 30 for holding a glass substrate 31, a cassette holder 20 provided in the etching bath 1 to hold the cassette 30, and an actuator 40 for holding the cassette 30, vertically moving the cassette 30 and outputting/inputting the cassette 30 from/to the etching bath 1. The cassette holder 20 is rotated by a motor 10 in the etching bath 1, and the cassette 30 is taken out from the etching bath 1 in the posture in which the cassette 30 is rotated substantially 180°in parallel with the moving axis of moving the cassette 30 to the posture that the cassette 30 is introduced into the etching bath 1. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006032609(A) 申请公布日期 2006.02.02
申请号 JP20040208590 申请日期 2004.07.15
申请人 SEIKO EPSON CORP 发明人 SAKAMOTO TAKESHI
分类号 H01L21/306;C23F1/08 主分类号 H01L21/306
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