| 摘要 |
PROBLEM TO BE SOLVED: To provide a connection structure and its manufacturing method wherein no adhesive resin, etc. are applied between conductor patterns of a connection part, and the connection resistance of a contact is small, even at a fine pitch, and no short circuit between the adjacent conductor patterns occurs. SOLUTION: The connection structure has a first circuit board 10, in which a plurality of first conductor patterns 14 having a constant pitch are formed on the face of a first resin member 12 which is softened by heating with fusion properties, and a second circuit board 20 in which a plurality of second conductor patterns 24 are formed at the same pitch as the pitch of the plurality of first conductor patterns 14. The first conductor patterns 14 are brought into mechanical contact with the second conductor patterns 24, to form an electric conductive state. With this structure, the first resin member 12 covers the first conductor patterns 14 and the second conductor patterns 24, to be adhered to the second resin member 22 of the second circuit board 20, and the first circuit board 10 is connected to the second circuit board 20. COPYRIGHT: (C)2006,JPO&NCIPI
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