| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip-type electronic component with high reliability which does not cause a defect such as a crack or gap derived from the stress or tension during forming processing. SOLUTION: A chip-type electronic component 1 is provided with a chip element, a resin case 10 with an accommodating part 11 which arranges chip elements, and at least one pair of lead frames 33 and 34 counterposed mutually with a prescribed interval in this resin case 10. Each pair of lead frames 33 and 34 is provided with pads 33a and 34a exposed to the accommodating part 11 in the resin case 10, bent parts 33b and 34b having a downward inclination to an outside direction succeeding the pads 33a and 34a, and external terminals 33c and 34c projecting horizontally from the resin case 10 and succeeding the pads 33b and 34b. At least the undersides of external terminals 33c and 34c are located below rather than a bottom 13 of the resin case 10. COPYRIGHT: (C)2006,JPO&NCIPI
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