| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid epoxy resin composition which can be reduced in curing time while maintaining preservability, can give cured articles superior in adhesion to the surface of a silicon chip and a solder resist, is superior in solder characteristics after absorbing moisture even if being cured at a curing temperature of 125°C or lower, and furthermore, which is not deteriorated under a hot and humid condition such as a PCT of 120°C/2.1 atm, and in which a peeling or clack does not occur even to over several hundreds cycles in temperature cycle of -65°C/150°C . SOLUTION: The liquid epoxy resin composition contains a liquid epoxy resin (A), a bisphenol-type episulfide modified resin (B) expressed by formula (1), and a microcapsule-type curing accelerator (C) as essential components. Provided that, R<SP>1</SP>, and R<SP>2</SP>are each a hydrogen atom or a methyl group. COPYRIGHT: (C)2006,JPO&NCIPI
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