发明名称 |
PRESSURE ASSISTED WAFER HOLDING APPARATUS AND CONTROL METHOD |
摘要 |
An electrostatic wafer holding apparatus includes an electrostatic chucking pedestal and a bi-directional backside conduit in fluid communication with a backside of the chucking pedestal. The bi-directional backside conduit is in fluid communication with a backside carrier gas supply line, and is further in fluid communication with a vacuum supply line.
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申请公布号 |
US2006023394(A1) |
申请公布日期 |
2006.02.02 |
申请号 |
US20040710653 |
申请日期 |
2004.07.27 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BAIN DAVID J.;BIRCHARD CHRISTOPHER S.;WONG KEITH K. |
分类号 |
H01T23/00 |
主分类号 |
H01T23/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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